prefect
Home Engineering Audio Biking Publications Photo Gallery Personal Info
DACS: Serial Communications Protocol
 
  next up previous contents
Next: Physical Layer Up: Firmware Protocols Previous: Firmware Protocols   Contents

Serial Communications Protocol

To facilitate communication between the embedded microcontrollers and the host PC, a serial communications protocol was developed. The protocol is relatively simple in design, but effective. The protocol consists of three layers: physical, framing, and application-specific. The physical layer relates to the actual medium and means of transmission. Framing relates to encapsulation and transmission/receipt of data packets. The application-specific layer defines messages that specific applications use to communicate.

Subsections

Steve Richardson 2000-07-06
Table of Contents

[PDF] [Whole document in PDF 1.9MB]

[more photos and information]

 
Page last modified:
Copyright © 1993-2000 prefect - All Rights Reserved.